Nested plug-in modules

ABSTRACT

A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of U.S. Provisional PatentApplication No. 60/253,777, filed Nov. 29, 2000, entitled “ModularElectronic Chassis/Backplane Configuration Having Nested Modules forIncreased Packaging Density” which is hereby incorporated by referenceherein in its entirety.

BACKGROUND

The present invention is generally directed to rack-mounted electronicmodules and, more specifically, to an electronic chassis having nestedplug-in modules and a backplane capable of use with the plug-in modules.

Plug-in modules are typically positioned side by side and each engages acommon vertically oriented planar backplane. Conventional modulestypically have a rectangular box shape with a backplane connectormounted thereon. Such modules usually slide into the electronic chassisthrough a front opening. In some cases, conventional modules areinserted into the electronic chassis on both sides of the backplane tomount the modules in a back-to-back fashion. Such mounting requires thatthe chassis depth be increased in order to properly contain and/orenclose the back-to-back modules. Some components contained inconventional modules do not require the full volume provided by theirrespective module housing which results in wasted space in the interiorof the electronic chassis.

Additionally, conventional backplanes used in an electronic chassis onlyreceive one size module so that using a smaller sized module to avoidwasted space inside the module housing will result in wasted spaceinside the interior of the electronic chassis containing the smallersized module, unless the backplane is positioned off center within themodule housing.

Conventional backplanes that receive modules on both major surfaces usean array of straight pins that extend through the backplane. Once thepins are arranged through the backplane, plastic headers are insertedover the pins on both sides of the backplane to form a double endedconnector. This results in the type of connector used on one side ofbackplane dictating the type of connector that exists on the oppositeside of the backplane and requires that the opposing connectors share acommon axis. This restricts the types of modules that can be attachedopposite from each other on both sides of the backplane.

What is needed, but so far has not been provided by the conventionalart, are plug-in modules that can be nested to improve packingefficiency within an electronic chassis. Also needed, but so far notprovided by the conventional art, is a backplane that can optionally beused with nested plug-in modules, that is capable of use in multiplepositions to increase the variety of plug-in modules that can be usedwith the backplane, that can be used in an electronic chassis thatreceives plug-in modules in a back-to-back fashion, that allowsdifferent types of connectors to be positioned oppositely on both sidesof the backplane, that can have connectors positioned generallyoppositely on both sides of the backplane without sharing a common axis,and that allows for an improved packing efficiency within the interiorof the electronic chassis.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will hereinafter be described in conjunction withthe appended drawing figures, wherein like numerals denote likeelements, and:

FIG. 1 is a front elevational view of a backplane according to thepreferred embodiment of the present invention illustrating the backplanein a first position in which a first circuit board and a second circuitboard are generally coplanar;

FIG. 2 is a front perspective view of the backplane of FIG. 1;

FIG. 3 is a cross-sectional view of an electronic chassis illustratingthe backplane of FIG. 1 medially positioned within the electronicchassis, configured in a second position in which the first circuitboard is spaced from and generally parallel to the second circuit boardof the backplane, and engaged with a first and second plug-in module ofthe preferred embodiment of the present invention;

FIG. 4 is a rear perspective view of the backplane of FIG. 1illustrating the backplane in a third position in which the firstcircuit board is located at an angle relative to the second circuitboard;

FIG. 5 is a right side elevational view of the first plug-in moduleshown in FIG. 3;

FIG. 6 is a rear perspective view of the first plug-in module shown inFIG. 5;

FIG. 7 is a front perspective view of the first plug-in module shown inFIG. 5;

FIG. 8 is a front perspective view of the electronic chassis with afront cover in the closed position;

FIG. 9 is a front perspective view of the electronic chassis of FIG. 8with the front cover in the open position;

FIG. 10 is a right side elevational view of the second plug-in moduleshown in FIG. 3;

FIG. 11 is a front perspective view of the second plug-in module shownin FIG. 10; and

FIG. 12 is a rear perspective view of the second plug-in module shown inFIG. 10.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

The ensuing detailed description provides a preferred exemplaryembodiment only, and is not intended to limit the scope, applicability,or configuration of the invention. Rather, the detailed description ofthe preferred exemplary embodiment will provide those skilled in the artwith an enabling description for making and using a preferred exemplaryembodiment of the invention. It is understood that various changes maybe made in the function and arrangement of elements without departingfrom the spirit and scope of the invention as set forth in the appendedclaims.

Referring to the drawings, wherein like numerals indicate like elementsthroughout, there is shown in FIGS. 1-4 a preferred embodiment of abackplane, generally designated 10. The backplane 10 of the presentinvention is operational in multiple positions which allows thebackplane 10 to be used with a variety of electronic housings and allowsfor increased packaging density within the interior of an electronichousing.

The backplane 10 is capable of receiving plug-in modules and provides afirst-module-receiving-location 76A and asecond-module-receiving-location 76B. The first and secondmodule-receiving-locations 76A, 76B are preferably formed by either afirst or second electrical connector 18, 26 (further described below).The backplane 10 preferably includes a first circuit board 12 having afirst perimeter 14 defining a first plane 16 and includes at least afirst electrical connector 18. The first circuit board 12 is preferablyformed of a rigid, heat resistant material. For example, the firstcircuit board 12 can be formed of plastic or phenolic material withprinted circuits located thereon.

The first circuit board 12 preferably has a generally rectangular shapewith first electrical plug-in connectors 18 disposed along one side. Thefirst electrical connector 18 can be any suitable type of single ormulti-channel connector adapted to electrically connect a plug-in moduleto the first circuit board 12 without departing from the scope of thepresent invention. Additionally, the first connectors 18 can bedifferent from each other without departing from the present invention.

A second circuit board 20 has a second perimeter 22 defining a secondplane 24 and includes at least a second electrical plug-in connector 26.The second circuit board 20 is preferably formed in the same manner asthe first circuit board 12. The second electrical connector 26 can be ofany suitable type of single or multi-channel connector adapted toelectrically connect a plug-in module to the second circuit board 20,and can vary in size or type without departing from the scope of thepresent invention.

A flexible member 28 preferably connects the first circuit board 12 tothe second circuit board 20 and establishes electrical communicationtherebetween. It is preferred that the first circuit board 12 and secondcircuit board 20 be connected by a flexible printed circuit member 28.However, the first circuit board 12 and the second circuit board 20 canbe interconnected by wires or rigid conductors or the like withoutdeparting from the scope of the present invention. Those of ordinaryskill in the art will appreciate from this disclosure that the firstcircuit board 12, the second circuit board 20, and the flexible member28 can be formed as one piece and include a printed circuit thereonwithout departing from the scope of the present invention.

The flexible member 28 is preferably attached along an edge 30 of thefirst perimeter 14 of the first circuit board 12 and is preferablyattached along an edge 32 of the second perimeter 22 of the secondcircuit board 20. While the flexible member 28 is shown as a singlecontinuous member extending between the first and second circuit boards12, 20, those of ordinary skill in the art will appreciate from thisdisclosure that the flexible member 28 can be formed of multiple,flexible, discrete segments of flexible material which connect the firstand second circuit boards 12, 20 without departing from the scope of thepresent invention. Those of ordinary skill in the art will alsoappreciate from this disclosure, that the strength and flexibility ofthe flexible member 28 can be selected based upon an anticipated use ofthe backplane 10 without departing from the present invention. Forexample, a flexible member 28 having sufficient strength can be used tosupport the second circuit board 20 above the first circuit board 12while only the first circuit board 12 is attached to the chassis 36.

The backplane 10 is operational in a first position (shown in FIGS. 1and 2), in which the first circuit board 12 is positioned so that thefirst plane 16 is generally coplanar with second plane 24. Those ofordinary skill in the art will appreciate from this disclosure that thefirst circuit board 12 is generally co-planar with the second circuitboard 20 when the second plane 24 is askew from the first plane 16 byapproximately ten (10) degrees or less.

As best shown in FIG. 3, the backplane 10 is also operational in asecond position in which the first circuit board 12 is positioned sothat the first plane 16 is spaced from and generally parallel to thesecond plane 24 and the first perimeter 14 extends over at least aportion of the second perimeter 24 when viewing the first circuit board12 along an axis 34 generally perpendicular to the first circuit board12. When the backplane 10 is in the second position, it is preferablethat the first electrical connectors 18 extend from the first circuitboard 12 in a first direction, generally away from the second circuitboard 20, and the second electrical connectors 26 extend from the secondcircuit board 20 in a second direction, generally opposite from thefirst direction. When the backplane 10 is in the second position it ispreferable that the flexible member is bent through an arc of betweenapproximately one hundred sixty (160) degrees and approximately onehundred ninety-five (195) degrees. It is more preferable, but notnecessary, that the flexible member be bent through an arc ofapproximately one hundred eighty (180) degrees.

The backplane 10 is preferably also operational while in a thirdposition (shown in FIG. 4), in which the first circuit board 12 ispositioned so that the first plane 16 is at an angle relative to thesecond plane 24. Thus, it is operable in any position between the firstand second positions, where the flexible member is bent betweenapproximately ten (10) degrees and approximately one hundred sixty (160)degrees.

Those of ordinary skill in the art will appreciate from this disclosurethat the backplane 10 is not limited to the above-described preferredembodiment. For example, the backplane 10 may be a single circuit board,a single circuit board having opposing surfaces each having at least onesurface mount assembly disposed thereon, two circuit boards pinnedtogether, two circuit boards wired together, or a rigid-flex circuitboard without departing from the scope of the present invention.Additionally, the first and second plug-in modules 40, 42 can bedisposed on a single major surface of a single circuit board withoutdeparting from the scope of the present invention. For example, a singlecircuit board can be disposed adjacent a bottom side of the electronicchassis 36 and receive first and second plug-in modules 40, 42 along asingle circuit board side at first and second module-receiving-locations76A, 76B.

Referring to FIGS. 3, 8 and 9, preferably the backplane 10 is located inan electronics-rack-housing, or electronic chassis, 36 and is configuredto receive plug-in modules 40, 42. It is preferred, but not necessary,that the electronic chassis 36 substantially enclose the first andsecond plug-in modules 40, 42. It is preferred that theelectronics-rack-housing 36, the first plug-in module 40, and the secondplug-in module 42 are formed of a strong durable material, such assteel, aluminum, a suitable polymeric material or the like. Theelectronic chassis 36 preferably has a generally rectilinear interior38. As shown in FIG. 3, the backplane 10 is preferably mediallypositioned in the interior 38. The first and second plug-in modules 40,42 are each detachably engageable with either of thefirst-module-receiving-location 76A and thesecond-module-receiving-location 76B. First and second plug-in modules40, 42 are preferably attached to the backplane 10 via the connectors18, 26 on the first and second circuit boards 12, 20.

Referring to FIGS. 3 and 5-7, the first plug-in module 40 preferably hasan L-shape and is preferably engageable with the first electricalconnector 18. The first plug-in module 40 includes a housing 44 with afirst-elongated-housing-portion 46 and a second-housing-portion 48.

The housing 44 of the first plug-in module 40 preferably has afirst-elongated-housing-portion 46 with a first end 52, a second end 54,and a longitudinal axis 56 (shown in FIG. 5). Thefirst-elongated-housing-portion 46 generally has the shape of arectangular box. However, those of ordinary skill in the art willappreciate from this disclosure that the shape of thefirst-elongated-housing-portion 46 can be varied without departing fromthe scope of the present invention. The housing 44 of the first plug-inmodule 40 preferably has a second-housing-portion 48 extending from thefirst-elongated-housing-portion 46 disposed proximate to the first end52 of the first-elongated-housing-portion 46. It is preferable that thesecond-housing-portion 48 be spaced from the first end 52 of thefirst-elongated-housing-portion 46.

The second-housing-portion 48 preferably has a connector surface 58oriented generally perpendicular to the longitudinal axis 56 and facinggenerally toward the second end 54 of first-elongated-housing-portion 46of the first plug-in module 40. A backplane connector 50 is preferablydisposed on the connector surface 58 of the second-housing-portion 48.The backplane connector 50 is preferably engageable with the firstelectrical connector 18 of the backplane 10 to electrically connect thefirst plug-in module 40 to the backplane 10.

Referring to FIGS. 3 and 10-12, the second plug-in module 42 preferablyhas a generally rectilinear shaped housing 78. As best shown in FIG. 12,the rear of the second plug-in module 42 preferably, but notnecessarily, includes a female electrical connector 80 for receiving oneof the backplane electrical connectors 18 or 26. As best shown in FIG.11, in the preferred embodiment, the second plug-in module 42 is a powersupply having an electrical connector 82 for connection to a power cableand having cooling fans 84. A handle 86 may optionally be disposed onthe front of the second plug-in module 42 to facilitate removal andinsertion of the second plug-in module 42.

Referring to FIGS. 3 and 8, a chassis axis 74 extends normal to themajor surface of the first and second plug-in modules 40, 42. It ispreferred that when the first and second plug-in modules 40, 42 areviewed along the chassis axis 74, the first and second plug-in modules40, 42 substantially fill a cross-sectional area defined by theelectronic chassis 36. Those of ordinary skill in the art willappreciate that the cross-sectional area is substantially filled when atleast seventy-five (75) percent of the cross-sectional area defined bythe electronic chassis 36 is occupied by the first and second plug-inmodules 40, 42. It is preferable, but not necessary, that the first andsecond plug-in modules 40, 42 substantially fill at least eighty-five(85) percent of the cross-sectional area defined by the electronicchassis 36. It is further preferable that the first and second plug-inmodules 40, 42 substantially fill at least ninety-five (95) percent ofthe cross-sectional area defined by the electronic chassis.Additionally, it is preferred, but not necessary, that the first plug-inmodule 40 have a first width (as measured along the chassis axis 74) andthat the second plug-in module 42 have a second width (as also measuredalong the chassis axis 74) that is different from the first width. Byallowing modules of different widths to be used, a designer is canpackage more of one type of module than another, depending on theanticipated use of the nested modules. For example, a designer maydesire that sixteen (16) application modules be used with two (2) powersupply modules. Modules of differing widths can be positioned alongopposing sides of the backplane 10 or along the same side of thebackplane 10 without departing from the scope of the present invention.

When the backplane connector 50 of the second-housing-portion 48 of thefirst plug-in module 40 is engaged with the first electrical connector18 of the backplane 10, the first-elongated-housing-portion 46 extendsbeyond the backplane 10 and past the second circuit board 20 as shown inFIG. 3. This leaves a space 60 within the electronics housing 36 whichoccupies at least a portion of the same plane as the first plug-inmodule 40 and which can receive a smaller, second plug-in module 42, asshown in FIG. 3. However, if desired, the second plug-in module 42 canbe wider than the first plug-in module 40 as is evident from acomparison of FIGS. 6 and 11. The second plug-in module 42 is engagedwith at least one of the second electrical connectors 26 and isconfigured to occupy at least a portion of the space 60 defined on afirst side 62 (the first side extending generally vertically as viewedin FIG. 3) by the second circuit board 20 and defined on a second side64 (the second side extends generally horizontally as viewed in FIG. 3)by a portion of the first-elongated-housing-portion 46 of the firstplug-in module 40 that extends past the second electrical connector 26.

It is preferable, but not necessary, that the second-housing-portion 48of the first plug-in module 40 be positioned to form, in combinationwith a side 64 of the interior 38 of the electronic housing or chassis36, a channel 66 between the first plug-in module 40 and the side 64 ofthe interior 38 to allow airflow between the backplane 10 and theatmosphere outside the electronic chassis 36.

Referring to FIGS. 8 and 9, an electronic chassis 36 capable of housinga plurality of modules 40, 42 is provided 10. The chassis 36 preferablyincludes at least one front or side opening 70 to access one of thefirst plug-in module 40 and the second plug-in module 42. In theembodiment of the present invention shown in FIG. 3 it is preferable tohave at least one opening 70 along each of the front and rear sides ofthe chassis.

Referring to FIG. 8, a door 72 is shown in the closed position.Referring to FIG. 9, the door 72 is rotated outwardly to provide accessto additional connectors on the plug-in modules. Those of ordinary skillin the art will appreciate from this disclosure that the presentinvention can include multiple doors and openings positioned on any sideof the electronic chassis 36.

While the principles of the invention have been described above inconnection with specific apparatus, it is to be clearly understood thatthis description is made only by way of example and not as a limitationon the scope of the invention.

What is claimed is:
 1. A modular electronic chassis system with rackmounted electronic modules, comprising: at least one circuit boarddefining first and second surface portions; a first electrical connectordisposed on the first surface portion of the at least one circuit boardand defining a first-module-receiving-location; a second electricalconnector disposed on the second surface portion of the at least onecircuit board and defining a second-module-receiving-location; a firstplug-in module having a housing with a first-elongated-housing-portionand a second-housing-portion, the second-housing-portion beingdetachably engaged with the first-module-receiving-location of the atleast one circuit board; and a second plug-in module being detachablyengaged with the second-module-receiving-location of the at least onecircuit board and configured to occupy at least a portion of a spacedefined on a first side by at least a part of the second-housing-portionand defined on a second side by at least a part of thefirst-elongated-housing-portion of the first plug-in module, wherein thefirst plug-in module and the second plug-in module are nested.
 2. Thesystem of claim 1, further comprising an electronic chassissubstantially enclosing the first and second plug-in modules.
 3. Thesystem of claim 2, wherein when the first and second plug-in modules areviewed along a chassis axis, the first and second plug-in modulessubstantially fill a cross-sectional area defined by the electronicchassis.
 4. The system of claim 3, wherein when the first and secondplug-in modules are viewed along the chassis axis, the first and secondplug-in modules substantially fill at least seventy-five (75) percent ofthe cross-sectional area defined by the electronic chassis.
 5. Thesystem of claim 3, wherein when the first and second plug-in modules areviewed along the chassis axis, the first and second plug-in modulessubstantially fill at least eighty-five (85) percent of thecross-sectional area defined by the electronic chassis.
 6. The system ofclaim 3, wherein when the first and second plug-in modules are viewedalong the chassis axis, the first and second plug-in modulessubstantially fill at least ninety-five (95) percent of thecross-sectional area defined by the electronic chassis.
 7. The system ofclaim 3, wherein the chassis includes at least front and side openingsto access any one of the first plug-in module and the second plug-inmodule.
 8. The system of claim 1, wherein the first plug-in module has afirst width, as measured along a chassis axis, and the second plug-inmodule has a second width, as measured along the chassis axis, differentfrom the first width.
 9. The system of claim 1, wherein the at least onecircuit board comprises a single circuit board.
 10. The system of claim9, wherein the single circuit board has opposing major surfaces eachhaving at least one surface mount assembly disposed thereon.
 11. Thesystem of claim 1, wherein the at least one circuit board comprises twocircuit boards pinned together.
 12. The system of claim 1, wherein theat least one circuit board comprises two circuit boards wired together.13. The system of claim 1, wherein the at least one circuit boardcomprises a rigid flex circuit board.
 14. The system of claim 1, whereinthe first plug-in module and the second plug-in module are disposed on asingle major surface of a single circuit board.
 15. The system of claim14, further comprising an electronic chassis substantially enclosing thefirst and second plug-in modules, wherein the single circuit board isdisposed adjacent a side of the electronic chassis.
 16. The system ofclaim 1, wherein the first-elongated-housing-portion has a first end, asecond end, and a longitudinal axis, the second-housing-portionextending from the first-elongated-housing-portion generallyperpendicularly to the longitudinal axis, the second-housing-portiondisposed proximate to the first end of thefirst-elongated-housing-portion and having a connector surface orientedgenerally perpendicular to the longitudinal axis and facing generallytoward the second end of the fret-elongated-housing-portion, thesecond-housing-portion having a backplane connector disposed on theconnector surface.
 17. The system of claim 16, wherein thesecond-housing-portion is spaced from the first end of thefirst-elongated-housing-portion.
 18. A modular electronic chassis systemwith rack mounted electronic modules, comprising: at least one circuitboard defining first and second surface portions; a first electricalconnector disposed on the first surface portion of the at least onecircuit board and defining a first-module-receiving-location; a secondelectrical connector disposed on the second surface portion of the atleast one circuit board and defining a second-module-receiving-location;a first plug-in module having a housing with afirst-elongated-housing-portion and a second-housing-portion, thesecond-housing-portion being detachably engaged with thefirst-module-receiving-location of the at least one circuit board; and asecond plug-in module being detachably engaged with thesecond-module-receiving-location of the at least one circuit board andconfigured to occupy at least a portion of a space defined on a firstside by at least a part of the second-housing-portion and defined on asecond side by at least a part of the first-elongated-housing-portion ofthe first plug-in module, wherein the first plug-in module and thesecond plug-in module are nested; and an electronic chassissubstantially enclosing the first and second plug-in modules, whereinthe electronic chassis includes a generally rectilinear interior,wherein the at least one circuit board is medially positioned in theinterior and the first plug-in module and the second plug-in module areattached to the at least one circuit board the second-housing-portion ofthe first plug-in module being positioned to form, in combination with aside of the interior of the electronic chassis, a channel between thefirst plug-in module and the side of the interior to allow air flowbetween the at least one circuit board and outside the electronicchassis.
 19. A modular electronic chassis system with rack mountedelectronic modules, comprising: at least one circuit board comprisingfirst and second circuit boards with a flexible member extendingtherebetween to establish electrical communication between the first andsecond circuit boards, wherein the first circuit board defines a firstsurface portion and the second circuit board defines a second surfaceportion; a first electrical connector disposed on the first surfaceportion of the at least one circuit board and defining afirst-module-receiving-location; a second electrical connector disposedon the second surface portion of the at least one circuit board anddefining a second-module-receiving-location; a first plug-in modulehaving a housing with a first-elongated-housing-portion and asecond-housing-portion, the second-housing-portion being detachablyengaged with the first-module-receiving-location of the at least onecircuit board; and a second plug-in module being detachably engaged withthe second-module-receiving-location of the at least one circuit boardand configured to occupy at least a portion of a space defined on afirst side by at least a part of the second-housing-portion and definedon a second side by at least a part of thefirst-elongated-housing-portion of the first plug-in module, wherein thefirst plug-in module and the second plug-in module are nested.
 20. Thesystem of claim 19, wherein the flexible member is attached to an edgeof a first perimeter of the first circuit board and is attached to anedge of a second perimeter of the second circuit board.
 21. The systemof claim 20 wherein the flexible member is bent through an arc betweenapproximately one hundred sixty (160) degrees and one hundredeighty-five (185) degrees.
 22. The system of claim 21 wherein theflexible member is bent through an arc of approximately one hundredeighty (180) degrees.
 23. The system of claim 22, wherein a firstelectrical connector extends from the first circuit board in a firstdirection, generally away from the second circuit board, and a secondelectrical connector extends from the second circuit board in a seconddirection, generally opposite from the first direction.
 24. The systemof claim 23, wherein the wherein first plug-in module is engaged withthe first electrical connector and has an L-shape; and the secondplug-in module is engaged with the second electrical connector and has arectilinear shape.
 25. A modular electronic chassis system with rackmounted electronic modules, comprising: at least one circuit boarddefines first and second surface portions; a first electrical connectordisposed on the first surface portion of the at least one circuit boardand defining a first-module-receiving-location; a second electricalconnector disposed on the second surface portion of the at least onecircuit board and defining a second-module-receiving-location; a firstplug-in module having a housing with a first-elongated-housing-portionand a second-housing-portion, the second-housing-portion beingdetachably engaged with the first-module-receiving-location of the atleast one circuit board; a second plug-in module being detachablyengaged with the second-module-receiving-location of the at least onecircuit board and configured to occupy at least a portion of a spacedefined on a first side by at least a part of the second-housing-portionand defined on a second side by at least a part of thefirst-elongated-housing-portion of the first plug-in module, wherein thefirst plug-in module and the second plug-in module are nested; and anelectronic chassis substantially enclosing the first and second plug-inmodules, wherein the second-housing-portion of the first plug-in moduleforms, in combination with the electronic chassis, a channel to allowair to flow between outside the electronic chassis and the backplane.